Patent Auction lists patented inventions available for sale or licensing. Inventors can list their patented inventions (or patent pending) for sale. New inventions for sale are added on a daily basis !
Home    List your patent    My account     Help     Support us     Contact us    

TSV Backside Reveal Structure and Exposing Process

[Category : - Computers and computer accessories ]
[Viewed 708 times]

A TSV exposing process is provided, including: performing a mechanical grinding process on the substrate back surface of a substrate with a TSV conductive column, a liner between the substrate and the TSV conductive column performing a first and a second chemical mechanical polishing process on the grinded substrate back surface then performing an etching on the substrate back surface, and making the TSV backside reveal more than 10 [mu]m.

[ Home | List a patent | Manage your account | F.A.Q.|Terms of use]

Copyright 2004-2017
Page created at 2020-11-24 18:20:25, Patent Auction Time.