---

Home    List your patent    My account     Help     Support us    

---

TSV Backside Reveal Structure and Exposing Process

[Category : - Computers and computer accessories ]
[Viewed 1156 times]

A TSV exposing process is provided, including: performing a mechanical grinding process on the substrate back surface of a substrate with a TSV conductive column, a liner between the substrate and the TSV conductive column performing a first and a second chemical mechanical polishing process on the grinded substrate back surface then performing an etching on the substrate back surface, and making the TSV backside reveal more than 10 [mu]m.

---

---

---

---

[ Home | List a patent | Manage your account | F.A.Q.|Terms of use | Contact us]

Copyright PatentAuction.com 2004-2017
Page created at 2024-04-26 10:09:26, Patent Auction Time.