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determining the contact potential difference of a wafer surface

[Category : - ELECTRONICS]
[Viewed 1092 times]

A method and system for determining the contact potential difference of a wafer surface using a non-vibrating contact potential difference probe and a vibrating contact potential difference probe. The method and system involves scanning the wafer surface with a non-vibrating contact potential difference sensor, integrating and scaling the resulting data, and applying offsets to individual tracks of data to match the integrated scaled data to measurements made using a vibrating contact potential difference sensor.

Patent publications:

 US 7752000
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aarontc (United States)

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