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Wafer inspection system

[Category : - ELECTRONICS]
[Viewed 1478 times]

A method and system for identifying a defect or contamination on a surface of a material. The method and system involves providing a material, such as a semiconductor wafer, using a non-vibrating contact potential difference sensor to scan the wafer, generate contact potential difference data and processing that data to identify a pattern characteristic of the defect or contamination.

Patent publications:

 US 7308367
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aarontc (United States)

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