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MEMS ULTRA-MINIATURE PIEZORESISTIVE PRESSURE SENSOR

[Category : - ELECTRONICS- HEALTH- DESIGN PATENTS]
[Viewed 1119 times]

A method of fabrication of one or more ultra-miniature piezoresistive pressure sensors on silicon wafers is provided. The diaphragm of the piezoresistive pressure sensors is formed by fusion bonding. The piezoresistive pressure sensors can be formed by silicon deposition, photolithography and etching processes.

Patent publications:

 US 9176018
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Seller:

qibinc (United States)

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