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Semiconductor wire bonding structure and method

[Category : - ELECTRONICS]
[Viewed 46 times]

The invention is about a semiconductor wire bonding structure and method. The wire bonding structure comprises a semiconductor component and a bonding wire. The weld pad of the semiconductor component is provided with a central concave part and an annular raised part. The bonding wire is provided with a connecting part jointed with the central concave part. The annular raised part continuously encircles the connecting part, and is approximately ring-shaped in an equal width manner.

Patent publications:

 CN 102723319
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Seller:

rayfw (Taiwan)

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