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All Patents for sale on PatentAuction.com.com
Order by : Date -
Views
Page : 31 out of 212 (40 patents per page)
1201.
Dielectric structure with different inside diameter
(413 views)
2 years ago
1202.
Heat sink etching process
(420 views)
2 years ago
1203.
Semiconductor substrate cutting device
(405 views)
2 years ago
1204.
Pads with different width
(391 views)
2 years ago
1205.
Semiconductor packaging structure and manufacturing method
(442 views)
2 years ago
1206.
Semiconductor assembly and semiconductor packaging structure
(398 views)
2 years ago
1207.
Dielectric layer has different inner diameter
(393 views)
2 years ago
1208.
Semiconductor wrapper and manufacturing method thereof
(405 views)
2 years ago
1209.
Optical module and optical sub-module thereof
(408 views)
2 years ago
1210.
Flip-chip bonding method and device
(409 views)
2 years ago
1211.
Chip jacking method and module
(431 views)
2 years ago
1212.
Semiconductor package with adhesion layer
(364 views)
2 years ago
1213.
Semiconductor element and sealing structure thereof
(423 views)
2 years ago
1214.
Shielding structure with different widths and areas
(364 views)
2 years ago
1215.
Semiconductor packaging structure and semiconductor process
(365 views)
2 years ago
1216.
SHIELDING FOR WARPAGE IMPROVEMENT
(391 views)
2 years ago
1217.
Distance piece and manufacturing method thereof
(344 views)
2 years ago
1218.
Semiconductor wire bonding structure and method
(403 views)
2 years ago
1219.
Proximity sensor packaging structure
(376 views)
2 years ago
1220.
Suction head for sucking solder ball
(412 views)
2 years ago
1221.
LED (Light Emitting Diode) packaging structure
(369 views)
2 years ago
1222.
Incision fixing fixture
(381 views)
2 years ago
1223.
Embedded circuit substrate
(360 views)
2 years ago
1224.
Semiconductor package with lateral signal lines
(371 views)
2 years ago
1225.
Semiconductor package assembly and manufacturing method thereof
(367 views)
2 years ago
1226.
Semiconductor encapsulation piece and manufacturing method thereof
(385 views)
2 years ago
1227.
Electronic device comprising micro-electro-mechanical system
(371 views)
2 years ago
1228.
Semiconductor packaging structure with shielding
(424 views)
2 years ago
1229.
Semiconductor package structure with reinforced metal layer
(389 views)
2 years ago
1230.
Semiconductor device with a thermal conductive structure
(404 views)
2 years ago
1231.
Semiconductor substrate structure
(422 views)
2 years ago
1232.
Band pass filter for wireless communication systems
(395 views)
2 years ago
1233.
CHIP STRUCTURE, WAFER STRUCTURE AND PROCESS OF FABRICATING CHIP
(394 views)
2 years ago
1234.
SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER
(436 views)
2 years ago
1235.
OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
(501 views)
2 years ago
1236.
Substrate structure of semiconductor device package
(426 views)
2 years ago
1237.
WIRING STRUCTURE, ASSEMBLY STRUCTURE AND METHOD
(423 views)
2 years ago
1238.
SEMICONDUCTOR SUBSTRATE AND MODULE
(384 views)
2 years ago
1239.
ANTENNA WITH A STACKING CONDUCTIVE STRUCTURE
(424 views)
2 years ago
1240.
Conductive bump has different dimensions
(417 views)
2 years ago
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