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ELECTRONICS


461 patents listed under ELECTRONICS

Patent document available 161. Package structure and package process
    (325 views)
1 year ago
Patent document available 162. 3D Package and Method of Making the Same
    (322 views)
1 year ago
Patent document available 163. Semiconductor packaging structure and manufacturing method
    (320 views)
1 year ago
Patent document available 164. SEMICONDUCTOR DEVICE AND METHOD
    (318 views)
1 year ago
Picture for patent availablePatent document available 165. The World's Only Smart Pen With Data Communication
    (318 views)
6 months ago
Patent document available 166. Substrate and manufacturing method thereof
    (317 views)
1 year ago
Patent document available 167. WIREBONDED SEMICONDUCTOR PACKAGE
    (317 views)
1 year ago
Patent document available 168. Chip jacking method and module
    (316 views)
1 year ago
Patent document available 169. Structure and manufacture method of circuit substrate
    (316 views)
1 year ago
Patent document available 170. SEMICONDUCTOR PACKAGE SUBSTRATES HAVING LAYERED CIRCUIT SEGMENTS
    (314 views)
1 year ago
Patent document available 171. SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR PROCESS
    (306 views)
1 year ago
Patent document available 172. Semiconductor element and sealing structure thereof
    (306 views)
1 year ago
Patent document available 173. SEMICONDUCTOR PACKAGE HAVING PROXIMITY COMMUNICATION SIGNAL
    (306 views)
1 year ago
Patent document available 174. Heat sink etching process
    (304 views)
1 year ago
Patent document available 175. ANTENNA WITH A STACKING CONDUCTIVE STRUCTURE
    (303 views)
1 year ago
Patent document available 176. Semiconductor packaging structure with shielding
    (302 views)
1 year ago
Patent document available 177. Semiconductor substrate structure
    (302 views)
1 year ago
Patent document available 178. SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER
    (302 views)
1 year ago
Patent document available 179. Substrate structure of semiconductor device package
    (302 views)
1 year ago
Patent document available 180. Making a Stackable Package
    (298 views)
1 year ago
Patent document available 181. Conductive bump has different dimensions
    (298 views)
1 year ago
Patent document available 182. Embedded substrate having circuit layer device
    (297 views)
1 year ago
Patent document available 183. CIRCUIT BOARD AND PROCESS OF FABRICATING THE SAME
    (297 views)
1 year ago
Patent document available 184. The electrical contacts have protrusion portions
    (297 views)
1 year ago
Patent document available 185. Semiconductor packaging with outer routing wire
    (297 views)
1 year ago
Patent document available 186. WIRING STRUCTURE, ASSEMBLY STRUCTURE AND METHOD
    (296 views)
1 year ago
Patent document available 187. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS
    (294 views)
1 year ago
Patent document available 188. SEMICONDUCTOR PACKAGE STRUCTURE HAS AT LEAST TWO BENDINGS
    (294 views)
1 year ago
Patent document available 189. REDISTRIBUTION LAYER STRUCTURE
    (292 views)
1 year ago
Patent document available 190. Optical module and optical sub-module thereof
    (290 views)
1 year ago
Patent document available 191. Semiconductor substrate cutting device
    (290 views)
1 year ago
Patent document available 192. Circuit substrate
    (289 views)
1 year ago
Patent document available 193. Flip-chip bonding method and device
    (288 views)
1 year ago
Patent document available 194. Semiconductor wrapper and manufacturing method thereof
    (287 views)
1 year ago
Patent document available 195. Suction head for sucking solder ball
    (287 views)
1 year ago
Patent document available 196. SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE
    (285 views)
1 year ago
Patent document available 197. Dielectric structure with different inside diameter
    (285 views)
1 year ago
Patent document available 198. Semiconductor package structure
    (285 views)
1 year ago
Patent document available 199. SEMICONDUCTOR DEVICE PACKAGE WITH A STACKED PATCH ANTENNA
    (285 views)
1 year ago
Patent document available 200. PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    (285 views)
1 year ago




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