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ELECTRONICS


471 patents listed under ELECTRONICS

Patent document available 161. Package structure and package process
    (511 views)
2 years ago
Patent document available 162. Semiconductor packaging structure and manufacturing method
    (502 views)
2 years ago
Patent document available 163. Substrate and manufacturing method thereof
    (501 views)
2 years ago
Patent document available 164. Semiconductor device package with matched passive components
    (499 views)
2 years ago
Patent document available 165. SEMICONDUCTOR DEVICE PACKAGES WITH PROTECTIVE LAYER
    (494 views)
2 years ago
Patent document available 166. SEMICONDUCTOR PACKAGE DEVICE AND SEMICONDUCTOR PROCESS
    (493 views)
2 years ago
Patent document available 167. Bonding wires with different curved directions
    (491 views)
2 years ago
Patent document available 168. WIREBONDED SEMICONDUCTOR PACKAGE
    (488 views)
2 years ago
Patent document available 169. Chip jacking method and module
    (487 views)
2 years ago
Patent document available 170. Semiconductor packaging structure with shielding
    (487 views)
2 years ago
Patent document available 171. Structure and manufacture method of circuit substrate
    (484 views)
2 years ago
Patent document available 172. OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME
    (483 views)
2 years ago
Patent document available 173. SEMICONDUCTOR PACKAGE HAVING PROXIMITY COMMUNICATION SIGNAL
    (482 views)
2 years ago
Patent document available 174. Semiconductor element and sealing structure thereof
    (480 views)
2 years ago
Patent document available 175. Heat sink etching process
    (478 views)
2 years ago
Patent document available 176. SEMICONDUCTOR PACKAGE SUBSTRATES HAVING LAYERED CIRCUIT SEGMENTS
    (477 views)
2 years ago
Patent document available 177. WIRING STRUCTURE, ASSEMBLY STRUCTURE AND METHOD
    (477 views)
2 years ago
Patent document available 178. Conductive bump has different dimensions
    (477 views)
2 years ago
Patent document available 179. Substrate structure of semiconductor device package
    (476 views)
2 years ago
Patent document available 180. ANTENNA WITH A STACKING CONDUCTIVE STRUCTURE
    (476 views)
2 years ago
Patent document available 181. Semiconductor packaging with outer routing wire
    (475 views)
2 years ago
Patent document available 182. Embedded substrate having circuit layer device
    (474 views)
2 years ago
Patent document available 183. SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS
    (474 views)
2 years ago
Patent document available 184. Semiconductor substrate structure
    (473 views)
2 years ago
Patent document available 185. Circuit substrate
    (473 views)
2 years ago
Patent document available 186. Making a Stackable Package
    (470 views)
2 years ago
Patent document available 187. Semiconductor device and method the same
    (469 views)
2 years ago
Patent document available 188. The electrical contacts have protrusion portions
    (468 views)
2 years ago
Patent document available 189. SEMICONDUCTOR PACKAGE STRUCTURE HAS AT LEAST TWO BENDINGS
    (468 views)
2 years ago
Patent document available 190. CIRCUIT BOARD AND PROCESS OF FABRICATING THE SAME
    (466 views)
2 years ago
Patent document available 191. SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE
    (466 views)
2 years ago
Patent document available 192. A semiconductor package structure includes a substrate
    (466 views)
2 years ago
Patent document available 193. Optical module and optical sub-module thereof
    (465 views)
2 years ago
Patent document available 194. Conductive pads with tapered surfaces and varying widths
    (465 views)
2 years ago
Patent document available 195. Dielectric structure with different inside diameter
    (463 views)
2 years ago
Patent document available 196. Semiconductor wire bonding structure and method
    (463 views)
2 years ago
Patent document available 197. Semiconductor substrate cutting device
    (463 views)
2 years ago
Patent document available 198. Flip-chip bonding method and device
    (461 views)
2 years ago
Patent document available 199. Suction head for sucking solder ball
    (460 views)
2 years ago
Patent document available 200. Semiconductor wrapper and manufacturing method thereof
    (459 views)
2 years ago




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